Bromont, july 13th 2012 – 2012 Si-EPIC workshop participants learn about IBM’s Microelectronics Packaging for Interconnecting Devices during a site visit and facilities tour of the MiQro Innovation Collaborative Centre.
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Sources:
Normand Bourbonnais
President, Chief Executive Officer – C2MI
450-534-8000
normand.bourbonnais@c2mi.ca