CAPACITY: Fully automatic flip chip bonder with chip supply unit 3D die bonding Chip on wafer (12 inch) Flux, NCP,
CAPABILITY: Suitable for prototype work Quick turnaround, no programming or part number set-up 1 mils Ø C4 on 2 mils
CAPABILITY: JEDEC tray input/output Accuracy +/- 10 µm @ 3 sigma, cpk 1.33 Theta axis rotary bond head 0˚ to
CAPABILITY: JEDEC tray input/output Accuracy +/- 3 µm @ 3 sigma cpk 1.33 Automatic calibration function to correct thermal changes
CAPABILITY: Ideal for product and process development Placement, thermo compression bonding capable Forming gas and formic acid available Automated pattern
