Partners:

• 3IT – Université de Sherbrooke
• CIRFE – University of Waterloo
• C2MI – MiQro Innovation Collaborative Center

Context:

In the context of collaboration with industrial partners, we are seeking 1 post-doctoral for the development, microfabrication and experimental characterisation of robust RF MEMS switches in industrial cleanroom facilities in collaboration with our industrial partners. Despite demonstrations of promising RF MEMS switches, commercial products commonly have problems at high frequencies and exhibit lower performance than expected. In addition, packaging affects the switch performance and should be done at the wafer-level for cost and reliability reasons. Through this collaborative effort, we will work together to address the challenges in design, microfabrication, packaging and reliability of high frequency RF MEMS switches to meet the needs for eventual commercialisation of these components.

Project Description:

Radio-frequency and micro-wave systems require increased flexibility to allow agile operation over a range of frequencies, according to the system’s position, or to be reprogrammable. MEMS (Micro-Electro-Mechanical Systems) RF switches are promising components for such systems which, by allowing or not an electrical contact, can be integrated in multiple circuits such as phasors, programmable filter or switch matrices. With increasing frequency ranges, to important challenges remain difficult to overcome: operation up to 20 GHz with minimal signal degradation and reliability. The Université de Sherbrooke and University of Waterloo, in collaboration with two industrial partners, propose to resolve these challenges by developing reliable RF-MEMS switches for high frequency operation, and conceived to account for wafer-level packaging and constraints for industrial applications. Such components, forming an active research field worldwide, require multidisciplinary range of skills, in the fields of RF engineering, electro-mechanical engineering, material science, microfabrication, and packaging technologies. This project brings a multidisciplinary team together to design the novel RF MEMS device and develop a microfabrication process that is compatible and leverages our industrial partner’s capabilities while integrating aspects of packaging and reliability from the start. The processing will be done in the state-of-the-art 200 mm cleanroom facilities of the MiQro Innovation Collaborative Center (C2MI), allowing the research and development activities to be realised on industrial-grade tools and processes.

Profile of candidates:

The candidate should have demonstrated autonomy, adaptability, the ability for team work and be pro-active. Good knowledge of materials and processes typically used in cleanroom microfabrication as well as relevant cleanroom experience are required. Knowledge in RF circuits and components, MEMS design, and their underpinnings are desirable assets. The candidates should have good language skills in English and ideally also speak French.

To submit your application, please send your detailed CV + letter of motivation + letters of recommendation by email to the addresses below.

Start date:

Immediately, according to the student’s availability.

Contacts:
Pr. Serge Charlebois, electrical engineering, 3IT-UdeS, Serge.Charlebois@usherbrooke.ca;
Serge Ecoffey, electrical engineering, 3IT-UdeS, Serge.Ecoffey@usherbrooke.ca;
The 3IT houses the International Mixed Unit LN2 (Laboratory Nanosystems & Nanotechnologies) of the CNRS.