The Université de Sherbrooke is a leading Canadian institution for research in advanced technologies for the interconnection and encapsulation of next generation microelectronic chips, also known as microlectronic packaging. Leveraging an extensive infrastructure in Sherbrooke (Institut Interdisciplinaire d’Innovation Technologique – 3IT) and Bromont (Centre de Collaboration MiQro Innovation – C2MI) and an NSERC-IBM Canada Industrial Research Chair in ‘Smarter Microelectronic Packaging for Performance Scaling’, a team of over 25 students and research professionals are involved in projects to model and validate innovative materials and processes, in both lab and industrial scale settings, in order to address the ever-challenging densities required for interconnecting heterogeneous microelectronic solutions in novel two-dimensional and three-dimensional (3D Integration) configurations.
Our Microelectronics Packaging group currently has openings for postdoctoral interns in the following research domains:

1. Validation and Characterization of an advanced, 3D System in a Packaging solution for future Exascale computing- the student will be responsible for the definition and validation of the overall assembly process flow for the 3D integration of processors and FPGA components and electrical/mechanical characterization thereof. Key areas of focus will be the fine pitch solder interconnections and their epoxy reinforcement.
2. Laser modification of surfaces for polymer encapsulant flow control – The assembly of multiple heterogeneous chips and components at unprecedented proximities impose restrictions on the deposition and flow of encapsulant materials that are used to reinforce chip interconnections; the student will study the use of lasers to modify several common substrate and interposer dielectric surfaces in order to render them hydrophobic to liquid encapsulant material flow. The study will comprise a thorough understanding of laser operation and parameters and the characterization and understanding of polymeric surface modification in relation to their hydrophobicity.
3. Wafer level temporary bonding materials and processes for 3D integration – The student will investigate various materials and methods currently marketed for temporary wafer bonding and debonding, validate selected combinations for specific custom applications for interposer and MEMS applications and propose novel modifications to improve the viability, cost or integrity of these combinations
4. Heterogeneous integration of high density memory crossbar for advanced data processing – This student will develop BEOL compatible processes at the 3IT for the fabrication of passive crossbar on CMOS chips with analog memory behaviour of metal oxide material. The mandate comprise both material investigation and design optimization. She/he will also investigate in depth the crossbar programming issue (crosstalk and voltage drop) and will propose optimal fabrication and programming strategies.

The candidate(s) should be a hands-on individual interested in working on various industrial scale assembly equipment, microfabrication tools and material characterisation tools, with a strong interest for interaction with industrial engineers and scientists. Preference will be given to candidates that additionally have a background in one or more of the following technology areas:

To apply or to obtain further information on these positions, kindly contact:
Professor Dominique Drouin (dominique.drouin@usherbrooke.ca)
David Danovitch (david.danovitch@usherbrooke.ca)