Accretech PG3000 RM

Packaging assembly laboratory / Wafer Dicing / Wafer thinning

Supplier :

Accretech

Model :

PG3000 RM

Purpose :

Thin up 200 / 300 mm wafer down to 50 µm (75µm with C4)

CAPABILITY:

Ultra-thin automated wafer handling

Automatic peeling and dicing frame (FF123) mounting

Chemical/Mechanical polishing station 0.15 µm roughness

TTV without device protection tape and resist film 2.5 µm

Non-contact probe for thickness measurement

Cleanliness:, chuck cleaning, pre/post BG tape cleaning

Wafer handling hand and pad cleaning

Wafer mounting accuracy for centering within 0.5 mm

Notch accuracy for dicing frame within 0.5 deg

Keywords

C2MI