RedStone™ delivers a robust solution to through via and routing applications for a wide variety of flex manufacturing needs. With the same accuracy, sturdy frame, and software functionalities as ESI’s other flex drilling systems, RedStone offers an ideal entry point for customers new to flex drilling.

SPECIFICATIONS:
Easily address most flex and rigid-flex PCB processing needs

LASER:
Nanosecond UV – 20W
MATERIAL HANDLING:
Vacuum chuck – 533mm x 635mm (±20um accuracy)
Electrical and software interface for web and panel handler integration

CAPABILITIES:
Laser via drilling and precision laser micromachining

MARKETS:
Flex PCB Laser Processing
Rigid-Flex Laser Processing
Laser Micromachining
Glass laser processing

MATERIALS:
Polyimide
Liquid Crystal Polymer (LCP)
Adhesiveless copper-clad polyimide laminates
Copper-clad polyimide laminates with adhesive
Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
Coverlay (Polyimide + Adhesive)

APPLICATIONS:
Through via drilling (THV)
Flex and interconnect processing
Blind via drilling (BHV)
Routing
Coverlay routing