Packaging assembly laboratory / Wirebond assembly / Wire bond
Hesse Mechatronics BJ653
Supplier :
Model :
Purpose :
Electrical connection between the chip and the substrate via gold or aluminum thin wire/ribbon or heavy aluminum round wire.
CAPACITY:
Automatic mode
Working area (x, y, z) : 100 x 115 x 42 mm
Axis accuracy : ±10 µm
Heated working area up to 200°C
Bond head rotation : 440°
DA07 bond head : thin wire, deep access
- Round wire Au, Al : 17.5µm – 50µm
- Ribbon Au, Al : 6×35µm – 25×250µm
- 2 inch spools
HBK10 bond head : heavy round wire
- Round wire Al : 50µm – 500µm
- 2-8 inch spools
Ebox option included
Field of view : 6×8 mm
