Packaging assembly laboratory / Balling / Ball placement
IBM SA-BATT
CAPABILITY:
Suitable for prototype work and production volumes
Quick turnaround, no programming, needs simple part number set-up.
Flux screening and ball placement 1 Jedec tray at the time
Up to 82 K (0.5 mm pitch/ 300 µm ball Ø) placed simultaneously
Form factor/part number personality tooling required:
Jedec metal tray, substrate holding base, flux and ball mask
27 form factor available from 15 mm to 55mm
Design service for personality tooling available
Vision system to align screen flux mask with Base
Squeegee pressure manually adjustable
Squeegee speed from 10 to 200 mm/sec
Screening Flux Mask alignment adjustable in X-Y-Z-Theta
Solder Ball mask adjustable in X-Y-Z-Theta
Low Solder Ball level detector
X axis: Linear motor for optimum operation (no backlash)
X axis resolution 1µm
X axis positioning repeatability +/- 2 microns (teached point)
Modules vacuum hold – module edge aligned
PGA pitch: minimum 0.5mm pitch