Packaging assembly laboratory / Others / Horizontal sputter
KDF Electronics & Vacuum Services Inc. / 943 GT
Supplier :
Model :
Purpose :
Process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles, commonly utilized for thin film deposition
Capability:
Surface free from contact point
Chamber dimension 7 x 23 x 69.5 inches ( D x H x W )
Pallet dimension 13 x 13 inches
Pellet height up to 2 inches
High vacuum pump ≤ 2×10-7 Torr
Radiant heater loadlock
Up to 3 Cathodes 12 x 37.8 cm
RF generator 1.5 KW (optional 3 KW)
DC Magnetron power supply 10 KW adjustable to 850V or 30 Amp
Scan speed (bi-directional) 2 to 400 cm/min
Etch level 0.1 to 1.5 KW
Deposition thickness uniformity across pallet for 1µm aluminum
+/- 5 % Planar using high uniformity magnets (DC or RF)
+/- 10% Planar using high utilization magnets (DC or RF)
Deposition thickness uniformity pallet to pallet +/- 5% all cathode type
Etch uniformity (with movable shutters)
Wafer to wafer +/- 7%
Across a wafer +/- 10%
