Analytical laboratory / Microsectioning / Ion milling
Leica RES 101
Supplier :
Model :
Purpose :
Ion beam preparation for thinning, cleaning and in-situ coating in one single system. This technique minimize the smearing generally associated with cross sectioning in soft material and for certain application can revealed sample microstructure.
CAPABILITY:
Sample up to 25 mm Ø
In-Situ coating of SEM and TEM sample with various target material
Surface cleaning, milling for contrast enhancement
Ion energy : 1keV to 10 KeV
Source current : up to 3.5 mA (per ion source)
Ion current density: 10 mA/sq cm (per ion source)
Milling rate : Cu 40μm/h (8kV,3mA)per ion source at 15 deg angle
Si 25μm/h (8kV,3mA)per ion source at 30 deg angle
Gaz: Argon, minimal purity 99.999% (Ar 5.0)
Angle tilting: Gun 1 +/- 45 deg (0.1 deg setting accuracy)
Gun 2 +/- 45 deg (0.1 deg setting accuracy)
Sample holder tilting: -120 to 210 deg (0.1 deg setting accuracy)
Milling angle: 0 to 90 deg (dependent on the sample holder)
Sample holder movement: Rotation 0.6 to 10 rpm
Oscillation up to 360 deg, in 1 deg steps
Movement x direction +/- 5 mm, 0.1 mm accuracy
Vaccum oil free ≤ 1×10-5 mbar
