Packaging assembly laboratory / Wafer Dicing / Taping backside grind
Lintec Adwill RAD-3500m12
Supplier :
Model :
Purpose :
Enable the backside grind tape to be laminated on the wafer
CAPACITY:
Slices up to 300mm
Positioning accuracy x, y axes: center offset ± 0.3mm
Planar orientation axe axis: offset ± 0.3 degree
Film width up to 330mm, roll 200mm maximum Ø
Lintec Series E and P Films or equivalent
Laminating the film without stress
Lamination and cutting of the film in a single operation
Rotation of the table and fixed knife for cutting the film
