Integrated microsystems laboratory (MEMS) / Wafer handling / Transfer system
Nadatech DP4200s / INX
Supplier :
Model :
Purpose :
Sort, align, flip and transfer wafers between SMIFs and open cassettes
CAPABILITY:
Wafer size: 200 mm
Thickness range of wafers: 300 – 1400 µm
Wafer material: Silicon, Glass, Bonded wafers, Perforated wafers
Transfer wafers between SMIFs and Open cassettes
Sort wafers in ascending/descending order
Notch alignment within ±0.1 °
Flip wafers
Prevent frontside and backside particle contamination
