Analytical laboratory / Mechanical testing / Ball pull
Nordson Dage 4000 Plus
Supplier :
Model :
Purpose :
Testing of bonds, solder joints, wires and substrate materials in the semiconductor and electronic manufacturing industry.
CAPABILITY:
Pull
Cold bump pull (200µm, to 750µm ball diameter)
Sample size: 10 mm to 100 mm
Cartridge: Up to 5 Kg load
Speed: Up to 5 mm/sec
Shear
Ball shear
Sample size: 10 mm to 100 mm
Cartridge Up to 5Kg
Speed: Up to 1mm/sec
Results
Display: Profile, Histogram, Trend, Pareto, Statistics
