Packaging assembly laboratory / Underfill / Plasma etch
Panasonic PSX307
CAPABILITY:
High speed, uniform plasma cleaner
Parallel plate RF back-sputtering method
O2 (option Ar)
High frequency power source 100 W to 600 W (13.56 MHz)
Diaphragm vacuum gauge, 266 Pa full scale
Rotary pump exhausting speed 345 L/min (60 Hz)
Mass flow controller Ar gas 2.5ml/min to 10 ml/min
O2 gas 10ml/min to 100 ml/min
Ultimate vacuum less than 3 Pa
Board dimension length : min 50 mm / max 330mm
Width : min 20 mm / max 120mm
Thickness: min 0.5mm / max 2.0 mm
Magazine dimensions : Length : min 100mm / max 350mm
- Width : min 25mm / max 125mm
- Thickness: min 70mm / max 240mm
- Etching rate:O2 plasma average 420 nm/min
Distribution +/- 30% or less
Cleaning area 10 mm inside board perimeter