Packaging assembly laboratory / Underfill / Plasma etch
PVA Tepla GIGAbatch 690
Supplier :
Model :
Purpose :
Cleaning of advanced chip packages using oxygen or argon plasma
CAPABILITY:
Process chamber:
Material Aluminum
Volume 91 liters
Inner dim. 450 x 450 x 450 mm ( H x W x D)
Plasma generation and gas flow: Large area, microwave plasma generation
No electrodes inside chamber
Gas flow variable depending of application
Plasma generation through right side chamber wall
Exhaust in left side chamber wall
Vacuum system: Ultimate pressure ≤ 10 -1 mbar
Process pressure approx. 0,2 – 1,5 mbar
Microwave plasma generator: Continuously adjustable magnetron, air cooled
Frequency 2.45 Gigahertz
Maximum output 1000 Watts
Rotating platform:
Material Aluminum, 350 mm Ø
Electrical drive starts after the process chamber is closed
Mass flow controller, up to 4 gaz channels possible. Currently O2 and Argon