CAPACITY:

Automatic slice support:

200 and 300mm
Thickness from 800µm to 190µm
Maximum number of bump / slice: 10 million

2D optical detection: 5µm

3D laser detection: 0.125µm, 4 MHz data acquisition rate

Depth of field: 28µm (2D), 200µm (3D)

Very high resolution 3D detector: 5µm

5-position lens turret: 1.25X, 2X, 5X, 10X)

Bright and dark field lighting

2D metrology and bump fault detection

3D measurement of height and coplanarity of bumps

Electronic slice mapping

Integrated ISO class 2 filtration unit

Remote computer fault review