Packaging assembly laboratory / Component placement / X-Ray inspection
Test Research Inc – TR7680
Supplier :
Model :
Purpose :
Non-destructive automated inspection of solder joints for presence of bridges, extra or missing material and mis-alignment
CAPABILITY:
Multiple angle cameras provide 3D +2D images
Maximum coverage, throughput and reliability with 3D
Digital Tomosynthesis Imaging Technology
Ideal for testing BGAs (including BGA Package on package–Pop), CGA, LGA , QGN, CSP, PTH, and other bottom termination components on both sides of a PCB
Inspection functions:
- Component: missing, misalignment, tombstone, billboard, tantalum polarity, skew
- Solder joint: insufficient/excess solder, short, open, solder ball, non-wetting, void, lifted lead
1µm X and Y axis resolution
5, 7, 10 µm image resolution
Max 130 Kv/300µA X-Ray tube selectable
6 axis control to provide maximum flexibility
Z axis automatic board warp compensation (up to 2.5 mm)
PCB size: min 50 x 50 mm (1.97 x 1.97 in); max 510 x 610 mm (20.0 x 24.0 in)
PCB thickness: 0.6 – 7 mm
Max PCB weight: 12 kg
Fully lead-shielded system safety cabinet-providing <0.5 µSv/hr X-Ray leakage