CAPABILITY:

Multiple angle cameras provide 3D +2D images

Maximum coverage, throughput and reliability with 3D

Digital Tomosynthesis Imaging Technology

Ideal for testing BGAs (including BGA Package on package–Pop), CGA, LGA , QGN, CSP, PTH, and other bottom termination components on both sides of a PCB

Inspection functions:

• Component:  missing, misalignment, tombstone, billboard, tantalum polarity, skew
• Solder joint: insufficient/excess solder, short, open, solder ball, non-wetting, void, lifted lead

1µm X and Y axis resolution

5, 7, 10 µm image resolution

Max 130 Kv/300µA  X-Ray tube selectable

6 axis control to provide maximum flexibility

Z axis automatic board warp compensation (up to 2.5 mm)

PCB size: min 50 x 50 mm (1.97 x 1.97 in); max 510 x 610 mm (20.0 x 24.0 in)

PCB thickness: 0.6 – 7 mm

Max PCB weight: 12 kg

Fully lead-shielded system safety cabinet-providing <0.5 µSv/hr X-Ray leakage