Packaging assembly laboratory / Component placement / Chip placement
Toray FlipChip Bonder
Supplier :
Model :
Purpose :
Automated high precision multi-chip die bonder for positioning and attaching small electronic components on printed circuit board or substrate.
CAPACITY:
Fully automatic flip chip bonder with chip supply unit
3D die bonding
Chip on wafer (12 inch)
Flux, NCP, NCF, Cupillar
High precision ( 2µm@3sigma)
2sec/chip cycle time
Thermocompression bonding (up to 450 C with ceramic head)
3x3mm to 20x20mm bonding head
