Integrated microsystems laboratory (MEMS) / Thermal treatment / High vacuum bake
YES PBV200HV
Supplier :
Model :
Purpose :
Anneal/Bake under controlled temperature and high vacuum conditions
CAPABILITY:
Wafer size: 200 mm
Production wafers per load: 50
Thickness range of wafers: 300 – 1700 µm
Temperature range: 20 – 450 °C
Pressure range: 10-6 – 500 Torr
Gases used: Oxygen, Nitrogen, Forming gas (H2 4% and N2 96%)
Wafer material: Silicon, Glass, Bonded wafers
Processes:
- Wafer dehydration processes
- Getter activation anneal cycles
- Thin film resistors thermal treatments
