Date / Time
Sunday, 04 March 2018
All day
Place
WekoPa Resort and Casino
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At the 14th International Conference and Exhibition on Device Packaging, participants can attend to various activities such as lectures, exhibitions, technical workshops, and networking.
C2MI employees will be present at the March 7, 2018, poster exhibition for their article on Effective Method for Wire Bonds Rework using Conductive Epoxy. In addition, C2MI will have a booth with IBM, it will be booth 16.
