CAPABILITY: Pull Cold bump pull (200µm, to 750µm ball diameter) Sample size: 10 mm to 100 mm Cartridge: Up  to

CAPABILITY: Tescan Mira-3 High Resolution Schottky Field Emission Scanning Electron Microscope (FESEM) Column Fully integrated Orsay Physics Plasma Xe source

CAPABILITY: Laser specification oriented to removed organic material Sealed 14 Watt Diode-Pumped IR laser module for decap ,Air cooled Nanosecond

CAPABILITY: Sample up to 25 mm Ø In-Situ coating of SEM and TEM sample with various target material Surface cleaning,

CAPABILITY: Cutting Rough cutting max sample size :50  X 50 cm Precision cutting : 160 X 50 mm / 70

CAPABILITY: Electro optical terahertz pulse reflectometry Non-destructive rapid fault isolation Locating faults within the device under test Fault position accuracy

CAPABILITY: Bulk glasses, polymers, plastics, garnets and other materials (both rigid and flexible) including liquids No matching fluids required Determination

CAPABILITY: Scanning area 310 x 307 mm +/- 0,5 micron repeatability of scan axis Inertially balanced for vibration free and

CAPABILITY: Resolution: < 0.6 um resolution: 0.5 micron feature recognition X-ray source:  Up to 150keV Field of View: 0.65mm x

CAPABILITY: Time Domain Reflectometry: 80E04 TDR Sampling Module (20Ghz) 80E10 TDR Sampling module (50GHz) Q-factor Extinction Ratio Signal-to-noise Ratio Wide