CAPABILITY: PCB dimensions: Single lane mode Batch mounting : L 50 × W 50 ~ L 750 × W 610

CAPABILITY:  100% forced convection reflow oven 17 heating zones, 170 inches of heating 34 independent temperature controllers Temperature gradient between

CAPACITY: Fully automatic flip chip bonder with chip supply unit 3D die bonding Chip on wafer (12 inch) Flux, NCP,

CAPABILITY: Multiple angle cameras provide 3D +2D images Maximum coverage, throughput and reliability with 3D Digital Tomosynthesis Imaging Technology Ideal

CAPABILITY: Conveyor belt stainless steel 24 ‘’ wide, 0.072 ‘’ wire x 3/8 ‘’ pitch 2 Jedec conveyor lane Adjustable

CAPABILITY: Fully automatic wire bonder Cassette in/out Typical ultra-fine pitch ball grid array product 45µm pad pitch 65 msec wire

CAPABILITY: JEDEC tray input/output Max conveyor capacity 2.2 Kg Digital pattern recognition system for optical registration  of the dispense site

CAPABILITY: Suitable for prototype work Quick turnaround, no programming or part number set-up 1 mils Ø C4 on 2 mils

CAPABILITY: Operation in manual or semi-automatic mode XYZ axes encoder precision: 0.0003” linear per     motor step Die placement precision of

CAPABILITY: JEDEC tray input/output Accuracy +/- 10 µm @ 3 sigma,  cpk 1.33 Theta axis rotary bond head 0˚ to