Primaxx fxP (VHF) Batch processing module (up to 25 200 mm wafers) Oxide etch rates: 0.1 à 10 um/min Oxide
CAPABILITY: Metal etch module Patented high density plasma source incorporating a radial coil design
CAPABILITY: Isopod – in-situ resist removal In-situ strip for corrosion prevention Isotropic polyimide removal (dry release)
CAPABILITY: Dielectric etch module Tailored chamber design to increase the process stability Plasma density necessary for the successful etching of
CAPABILITY: SI DRIE module Patented dual plasma source with indepemdently controlled primary and secondary decoupled plasma zones Excellent uniformity
CAPABILITY: Choice of plasma sources Forming gas 3.5% provides the advantage of catalysis for generation of atomic oxygen in plasma
