CAPABILITY: Processing 200 mm wafers and 3D-Integrated MEMS devices with wafer-level packages. Bond 200 mm wafers using fusion bonding, glass
CAPABILITY: Dry-in/dry-out automated SMIF pod input/output operation; Mini-environment within wet bench secures class 1 clean room performance on the wafer
CAPABILITY: Dry-in/dry-out automated SMIF pod input/output operation; Mini-environment within wet bench secures class 1 clean room performance on the wafer
CAPABILITY: Isopod – in-situ resist removal In-situ strip for corrosion prevention Isotropic polyimide removal (dry release)
CAPABILITY: Dielectric etch module Tailored chamber design to increase the process stability Plasma density necessary for the successful etching of
CAPABILITY: SI DRIE module Patented dual plasma source with indepemdently controlled primary and secondary decoupled plasma zones Excellent uniformity
CAPABILITY: Choice of plasma sources Forming gas 3.5% provides the advantage of catalysis for generation of atomic oxygen in plasma
CAPABILITY Single chamber DUV Phototabilizer; Compatible with 200mm and 150mm wafers sizes; UV Bake process applications; Irradiator contains Hg high
CAPABILITY: 5X Stepper Aligner Resolution down to 350 nm Front-to-front alignment: 50 nm, 3 sigma Back-to-back alignment: 80 nm, 3
CAPABILITY Wafer size: 200 mm Production wafers per load: 50 Thickness range of wafers: 300 – 1700 µm Temperature range:
