CAPACITY Provides multiple critical dimensions in one measurement 2D overlay and CD metrology Pattern recognition on 3D surface topography Metrology

CAPACITY: Wafer size: 200 mm Thickness range of wafers: 300 – 1700 µm Wafer types: Silicon, Glass, Bonded Si-to-Si wafer

CAPACITY Spectroscopic reflectometry UV-VIS-NIR-IR Film thickness from 190 nm to 15.0 µm Film properties (t, n, k): Organic films (UV)

CAPABILITY: Wafer size: 200 mm Thickness range of wafers: 300 – 1200 µm Wafer types: Silicon, Glass, perforated wafers, wafers