CAPABILITY: Electro optical terahertz pulse reflectometry Non-destructive rapid fault isolation Locating faults within the device under test Fault position accuracy

CAPABILITY: Bulk glasses, polymers, plastics, garnets and other materials (both rigid and flexible) including liquids No matching fluids required Determination

CAPABILITY: Scanning area 310 x 307 mm +/- 0,5 micron repeatability of scan axis Inertially balanced for vibration free and

CAPABILITY: Resolution: < 0.6 um resolution: 0.5 micron feature recognition X-ray source:  Up to 150keV Field of View: 0.65mm x

CAPABILITY: Time Domain Reflectometry: 80E04 TDR Sampling Module (20Ghz) 80E10 TDR Sampling module (50GHz) Q-factor Extinction Ratio Signal-to-noise Ratio Wide

CAPABILITY: X-ray column: Max Voltage 160 kV Max Current 600µA Sub-micron imaging resolution 3 focusing mode (nanoFocus, microFocus, High Power)