Underfill for flip chip and chip scale packaging Chip encapsulation Dam and fill Thermal compounds Exterior bulk fluid reservoir Tactile
CAPABILITY: MultiMEGTM Megasonic generator: 2 central frequencies available (430kHz or 1.3MHz) with a sweep of 1% around the central frequency
Capability: Surface free from contact point Chamber dimension 7 x 23 x 69.5 inches ( D x H x W