CAPABILITY: PCB dimensions: Single lane mode Batch mounting : L 50 × W 50 ~ L 750 × W 610
CAPABILITY: Dot placement accuracy at full speed : ±35µ at 3 sigma Product processing of >900mm Contact and non-contact heating
CAPACITY: 200mm wafers Pneumatic ram with speed control and 3″ adjustable stroke Motorized circular cutter assembly Digital temperature-controlled heated stage
CAPACITY: Fully automated mode 200mm wafers X-axis : Feeding speed : 1.0 – 1000 mm/s Y-axis : Index step : 0.1µm Position accuracy : 3µm
CAPACITY: Automatic mode Working area (x, y, z) : 100 x 115 x 42 mm Axis accuracy : ±10 µm Heated working
CAPABILITY: Multiple Angle Cameras Provide 3D +2D Images Maximum Coverage, Throughput and Reliability with 3D Digital Tomosynthesis Imaging Technology Ideal
CAPABILITY: Fast scanning and precise scan fixture positioning for higher throughput Jedec tray size transfer fixture L shaped tank with
CAPABILITY: Integrated input and output elevators load and unload stacked tray Inertially balanced for vibration free and shock free operation
CAPABILITY: XY placement accuracy +/- 75 µm @ 3 sigma Encoder resolution 2 µm Speed 500 mm/sec Gantry drive system,
CAPABILITY: Process chamber: Material Aluminum Volume 91 liters Inner dim. 450 x 450 x 450 mm ( H x W
