CAPABILITY: Semi-Automatic equipment Automatic alignment of substrate position and dispense Manually load/unload substrate on the dispense stage Substrate: min size
CAPABILITY Working volume 21’’ H x 14.5’’ W x 27 ‘’D 9 quartz shelves in the chamber Electrode on chamber
CAPABILITY: 100% forced convection reflow oven 17 heating zones, 170 inches of heating 34 independent temperature controllers Temperature gradient between
Underfill for flip chip and chip scale packaging Chip encapsulation Dam and fill Thermal compounds Exterior bulk fluid reservoir Tactile
CAPABILITY: MultiMEGTM Megasonic generator: 2 central frequencies available (430kHz or 1.3MHz) with a sweep of 1% around the central frequency
Capability: Surface free from contact point Chamber dimension 7 x 23 x 69.5 inches ( D x H x W
CAPABILITY: Developed for applications requiring absolutely minimal defects due to particulate damage Chamber dimension 7 x 23 x 69.5 inches
Capability: Modular metrology platform: 300X300X200mm Accuracy: 3 µm (z axis) Tech. specs: mfd 2nm/mm, sigma/step inf. 3nm 2 on-board indexed
CAPABILITY: Pull Cold bump pull (200µm, to 750µm ball diameter) Sample size: 10 mm to 100 mm Cartridge: Up to
CAPABILITY: Stroke (x-y-Z) 300 x 200 x 150 mm Minimum readout 0.1 µm Maximum work piece weight 20 Kg Measuring
