CAPABILITY: Multiple axes (Cartesian) gantry system Continuous mode of production by use of a leapfrog conveyor. 2 independent heads for

CAPABILITY: XY placement accuracy +/- 75 µm @ 3 sigma Encoder resolution 2 µm Speed 500 mm/sec Gantry drive system,

CAPABILITY: Handling wafer with diameter up to 200 mm Maximum batch of 50 200 mm wafers Chamber Cleanliness of Class 1

CAPABILITY: Gantry drive system, closed-loop DC, servo ball screw drive Work area in X-Y direction 18 x 18 inches Actual

CAPABILITY: High speed, uniform plasma cleaner Parallel plate RF back-sputtering method O2 (option Ar) High frequency power source 100 W

CAPABILITY: Input/output Jedec tray Multiple axes (Cartesian) gantry system with two independents heads. X-Y placement accuracy +/- 50 µm Encoder

CAPABILITY: Internal chamber volume 11 cubic feet 38 x 20 x 26 inches (W x D x H) Chamber interior,

CAPABILITY: Stainless steel vacuum chamber 18 W x24 H x 18 D inches One electrode technology shelf-sets with 14 positions

CAPACITY: Irregular slices up to 300mm with solder balls or wire solder site Slices of glass, ceramics, overlays, SiC, Sapphire,

CAPACITY: Irradiation on a section of wafer: 310 mm Ø Irradiation over the entire surface: 382 mm Ø Applicable frame