CAPABILITY: Electronic wafer map Conversion to make software compatible with ALPS wafer map Wafer expending film frame or ring holder

CAPACITÉ: Lampe UV multi faisceaux de 365nm Rainure simple passe de 60 µm de large Capacité d’épaisseur d’échantillon jusqu’à 1.5mm

CAPACITY: Automatic slice support: 200 and 300mm Thickness from 800µm to 190µm Maximum number of bump / slice: 10 million

CAPABILITY: Ultra-thin automated wafer handling Automatic peeling and dicing frame  (FF123) mounting Chemical/Mechanical polishing station  0.15 µm roughness TTV  without

CAPACITÉ: Ajustement manuel de la tranche et de son cadre Application du film, découpe et retrait de l’excédent en mode

CAPACITY: Slices up to 300mm Positioning accuracy x, y axes: center offset ± 0.3mm Planar orientation axe axis: offset ±

CAPACITY: Fully automatic flip chip bonder with chip supply unit 3D die bonding Chip on wafer (12 inch) Flux, NCP,

CAPABILITY: Fully automatic wire bonder Cassette in/out Typical ultra-fine pitch ball grid array product 35µm minimum pad pitch 2µm @

CAPABILITY: Multiple angle cameras provide 3D +2D images Maximum coverage, throughput and reliability with 3D Digital Tomosynthesis Imaging Technology Ideal

CAPABILITY: Conveyor belt stainless steel 24 ‘’ wide, 0.072 ‘’ wire x 3/8 ‘’ pitch 2 Jedec conveyor lane Adjustable