CAPACITY: 200mm wafers Pneumatic ram with speed control and 3″ adjustable stroke Motorized circular cutter assembly Digital temperature-controlled heated stage
CAPACITY: Fully automated mode 200mm wafers X-axis : Feeding speed : 1.0 – 1000 mm/s Y-axis : Index step : 0.1µm Position accuracy : 3µm
CAPACITY: Irregular slices up to 300mm with solder balls or wire solder site Slices of glass, ceramics, overlays, SiC, Sapphire,
CAPACITY: Irradiation on a section of wafer: 310 mm Ø Irradiation over the entire surface: 382 mm Ø Applicable frame
CAPABILITY: Electronic wafer map Conversion to make software compatible with ALPS wafer map Wafer expending film frame or ring holder
CAPACITÉ: Lampe UV multi faisceaux de 365nm Rainure simple passe de 60 µm de large Capacité d’épaisseur d’échantillon jusqu’à 1.5mm
CAPACITY: Automatic slice support: 200 and 300mm Thickness from 800µm to 190µm Maximum number of bump / slice: 10 million
CAPABILITY: Ultra-thin automated wafer handling Automatic peeling and dicing frame (FF123) mounting Chemical/Mechanical polishing station 0.15 µm roughness TTV without
CAPACITÉ: Ajustement manuel de la tranche et de son cadre Application du film, découpe et retrait de l’excédent en mode
CAPACITY: Slices up to 300mm Positioning accuracy x, y axes: center offset ± 0.3mm Planar orientation axe axis: offset ±
