Welcome to IMAPS 2016, Pasadena — Packaging the Connected World —
the 49th International Symposium on Microelectronics!

IMAPS Pasadena is the LARGEST Conference Program for Microelectronics,
Assembly, 2.5/3D, Emerging Applications, Materials &
Advanced Packaging in the FALL of 2016:
3 Days, 25 Sessions, 5 Keynotes, 140+ Speakers!!

— Packaging the Connected World —

the 49th International Symposium on Microelectronics! IMAPS Pasadena is the LARGEST Conference Program for Microelectronics,

Assembly, 2.5/3D, Emerging Applications, Materials

&  Advanced Packaging in the FALL of 2016: 3 Days, 25 Sessions, 5 Keynotes, 140+ Speakers!!