Service offering

Founded in 1959, Gentec offers turnkey electronic board assembly services and excels in high complexity :

• SMT equipment capable of assembling 01005 and double QFN
• Soldering on 20 layers and more
• 12-zone furnace
• Fine pitch (0.002” on BGA and BLGA, 0.003” on parts with tabs and 0.004” on DFNs and QFNs)
• Class 3 documented
• 100% AOI 3D inspection
• Test procedures meeting the requirements of mission-critical industrial products
• ISO 9001: 2015, IPC A610, J-STD-001

Mission

Gentec understands the importance of superior welding quality for its customers, who are under pressure to test prototypes quickly so as not to delay their product’s launch.

It is also aware of the flexibility required by its customers’ operations departments, which need to adjust quickly to fluctuations in demand once the product is on the market, while minimizing inventory.

Competence

Recent improvements and automation projects enable Gentec to offer competitive prices while maintaining superior assembly quality.

In addition to surface-mount manufacturing (SMT), Gentec also offers through-hole assembly, manual assembly, wiring, testing, coating, packaging and shipping to the end customer. Its team of 30 engineers can also assist customers in the development of their electronic boards and software.