NSERC - IBM CANADA LTÉE INDUSTRIAL RESEARCH CHAIR
The three holders of this Chair, namely, David Danovitch, Julien Sylvestre, and Dominique Drouin of the Université de Sherbrooke's Faculty of Engineering.
— C2MI: A UNIQUE MODEL OF INDUSTRY-UNIVERSITY PARTNERSHIP —
The Université de Sherbrooke has joined with IBM Canada Ltd. in a unique business/university partnership by launching the NSERC/IBM Canada Industrial Research Chair in Smarter Microelectronics Packaging for Performance Scaling.
OBJECTIVES OF THE CHAIR
Knowledge in this sector is growing at a dazzling pace. But the ever-increasing miniaturization of microelectronic chips raises some major technological challenges.
For example, low compatibility makes it difficult to put some materials together. In addition, the increasingly high circuit density of some chips causes temperatures to rise higher than a frying pan. As a result, researchers have to create chips that can withstand these extreme conditions. The NSERC/IBM Canada Industrial Research Chair objectives is to develop several new approaches ranging from robust industrial manufacturing processes to the development of new materials that increase the resistance and reliability of electronic components. This is a unique university-business partnership launched with an investment of $ 9.1 million.
VIDEO REPORT
THREE COMPLEMENTARY FIELDS
Packaging technologies must respond to the ever higher performance of electronic devices through the creation of completely new, even revolutionary, technical solutions. To achieve this end, the Chair brings together three complementary fields:
- Packaging-process innovations — integrate multiple 2D and 3D chips
- Housing designs — balance thermal, mechanical, and electrical performance
- Basic scientific advancement — packaging
