Indeed, Canada and the United States enjoy a complementary relationship in the field of advanced packaging.

Advanced packaging refers to the technology used to integrate different electronic components into a single assembly, thereby improving the performance and efficiency of electronic devices.

C2MI plays a key role in providing state-of-the-art research infrastructures and specialized technical expertise in the field of advanced packaging in particular.

C2MI’s state-of-the-art facilities enable researchers and companies to explore new methods and technologies for advanced packaging and achieve significant and often disruptive breakthroughs.

The USA, meanwhile, is renowned for its expertise and leadership in the semiconductor and electronics industry. It boasts numerous cutting-edge companies, research centers and a thriving ecosystem focused on innovative technologies.

By collaborating with C2MI, American companies and researchers can access a diversity of expertise and knowledge from different backgrounds. This collaboration fosters the exchange of ideas, technology transfer and the creation of innovative solutions for advanced chip assembly.