Laboratoire d'assemblage de semi-conducteurs / Positionnement des composantes / Positionnement de puce
IBM N-tool
CAPABILITY:
Suitable for prototype work
Quick turnaround, no programming or part number set-up
1 mils Ø C4 on 2 mils pitch capable
Single vacuum placement tool
Z-Theta axis hold placement tool
Z axis travel 175 mm
Z detection touching probe to ensure chip soft landing
Spring loaded system on Z axis for constant and stable force
Acme ball screw on Z axis to prevent head falling down on an EMO
Vertical mechanical structure assembly with good damping properties
Granit base for maximum stability
Aerotech X-Y table, advanced direct-drive technology
Linear motors, anti-creep crossed-roller bearing, non-cogging, non-contact
X-Y axis resolution 1µm, accuracy 250 µm
X-Y stroke 160 mm
Micro/macro joystick speed adjustment for X-Y displacement
Retractable and vibration free beam splitter
Beam splitter adjustments around central focus point of camera
3 cameras, one 2048×2048 pixels, and 2 cameras 1024×1024 pixels
Each lateral camera have independent height with X-Y-Z Theta adjustments
Corners diagonally oriented on product for maximum placement accuracy
Positioning repeatability +/- 2 microns