Laboratoire de vérification électrique / Inspection automatisée d'interconnection / Inspection de substrats
KLA Tencor ICOS CI-T130S
Fournisseur :
Modèle :
Fonction :
Fully automated component inspection systems combining bump inspection, substrate top and bottom surface inspection, warpage and coplanarity inspection
CAPABILITY:
Jedec tray input output ( 1 input / 3 output)
Substrate or component size 4 x4 mm up to 68.5 x 68.5 mm
2D/3D bump inspection
Component laser or ink marking inspection
Staggered grid layout inspection
BGA and LGA inpection
Component thickness inspection available 2.7 mm to 3.7 mm
Minimum bump size unflattened 70 µm
Minimum bump size flattened 60 µm
Ball presence/absence, , extra ball detected
Reporting for each parameter LSL, NML, USL, min, avg, 3 sigma CP, CPk
